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Q3: In the following figure, ten cross sectional views of an etched (100) silicon wafer with a stress-free diaphragm is shown. The wafer has a square opening on the back side through which the silicon can be etched (the diaphragm material is not attacked by any silicon etchant). You have access to only EDP and DRIE for etching the silicon, and these can be used in any sequence and as many times as you want. Please show which of the following ten cross sections can be actually obtained using these etchants. Simply circle the ones that are possible and provide a short description of how to achieve each of the cross section using the processes provided (i.e. EDP and DRIE), (30pts) 125.3° D C 125.3″ 25.3 125.3° SA?


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